Please use this identifier to cite or link to this item: http://repositorio.lnec.pt:8080/jspui/handle/123456789/1000363
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dc.contributor.authorCustódio, J.pt_BR
dc.contributor.authorCruz, H.pt_BR
dc.contributor.authorBroughton, J.pt_BR
dc.date.accessioned2010-07-07T10:15:57Zpt_BR
dc.date.accessioned2014-10-20T15:58:12Zpt_BR
dc.date.accessioned2017-04-12T14:42:38Z-
dc.date.available2010-07-07T10:15:57Zpt_BR
dc.date.available2014-10-20T15:58:12Zpt_BR
dc.date.available2017-04-12T14:42:38Z-
dc.date.issued2010pt_BR
dc.identifier.urihttps://repositorio.lnec.pt/jspui/handle/123456789/1000363-
dc.description.abstractThis paper describes the investigation carried out to address existing concerns about the reliability of bonded-in rod joints used in the rehabilitation of timber structures. The investigation assessed the influence of service temperature and humidity, timber species, realistic load history and applied stresses on the performance and durability of two commercial two-component structural epoxy adhesives, as well as their effect on bonded joints. From the investigation it was possible to develop a novel method to assess the long-term behaviour of bonded joints between timber and various adhesives and connecting materials suitable for timber structures rehabilitation. The data collected so far using the RPAT (realistic performance assessment test) appears to indicate that the developed method is assessing correctly the end-use performance for different adhesives as well as for different timbers.pt_BR
dc.language.isoengpt_BR
dc.rightsopenAccesspt_BR
dc.subjectTimberpt_BR
dc.subjectEpoxypt_BR
dc.subjectBonded-in rod jointspt_BR
dc.subjectDurabilitypt_BR
dc.titleExperimental assessment of the durability of bonded-in rod joints used in the rehabilitation of timber structurespt_BR
dc.typeconferenceObjectpt_BR
dc.identifier.seminario11th World Conference on Timber Engineering - WCTE 2010pt_BR
dc.identifier.localTrentino, Itáliapt_BR
dc.description.sectorDM/NBpt_BR
dc.description.year2010pt_BR
dc.description.data20 a 24 de Junhopt_BR
Appears in Collections:DM/NMC - Comunicações a congressos e artigos de revista



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