Please use this identifier to cite or link to this item: http://repositorio.lnec.pt:8080/jspui/handle/123456789/1017005
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dc.contributor.authorR. CRUZpt_BR
dc.contributor.authorL. CORREIApt_BR
dc.contributor.authorCabral-Fonseca, S.pt_BR
dc.contributor.authorJ. SENA-CRUZpt_BR
dc.date.accessioned2023-12-21T14:50:31Zpt_BR
dc.date.accessioned2024-03-05T18:05:40Z-
dc.date.available2023-12-21T14:50:31Zpt_BR
dc.date.available2024-03-05T18:05:40Z-
dc.date.issued2021-07-25pt_BR
dc.identifier.citationhttps://doi.org/10.1016/j.ijadhadh.2021.102961pt_BR
dc.identifier.urihttps://repositorio.lnec.pt/jspui/handle/123456789/1017005-
dc.description.abstractThis paper addresses the viscoelastic behaviour of a commercially available cold-curing structural epoxy adhesive, under different preparation, curing and hygrothermal conditions. The main parameters studied were the preparation method (influence of the degassing and the temperature of the initial curing), the creep stress level, and the hygrothermal conditions. Tensile creep tests last up to 2400 h. Test results revealed that the preparation method has great influence on the tensile properties of the adhesive, particularly on the viscoelastic response where degassing and curing at 20 ◦C showed lower creep deformations. Specimens under 98% of relative humidity faced tertiary creep and then rupture. For the adopted levels of creep stress, the adhesive shows a linear creep behaviour, being parameterized using the Burgers and the modified Burgers equations.pt_BR
dc.language.isoengpt_BR
dc.publisherElsevierpt_BR
dc.relationPOCI-01-0145-FEDER-016900pt_BR
dc.rightsrestrictedAccesspt_BR
dc.subjectepoxy adhesivept_BR
dc.subjectViscoelasticitypt_BR
dc.subjectCreeppt_BR
dc.subjectCuring conditionspt_BR
dc.titleEffects of the preparation, curing and hygrothermal conditions on the viscoelastic response of a structural epoxy adhesivept_BR
dc.typeworkingPaperpt_BR
dc.description.volume110pt_BR
dc.description.sectorDM/NMOpt_BR
dc.description.magazineInternational Journal of Adhesion and Adhesivespt_BR
dc.contributor.peer-reviewedSIMpt_BR
dc.contributor.academicresearchersSIMpt_BR
dc.contributor.arquivoNAOpt_BR
Appears in Collections:DM/NMO - Comunicações a congressos e artigos de revista

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