Please use this identifier to cite or link to this item: http://repositorio.lnec.pt:8080/jspui/handle/123456789/16956
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dc.contributor.authorCustódio, J.pt_BR
dc.contributor.authorCruz, H.pt_BR
dc.contributor.authorNegrão, J.pt_BR
dc.contributor.authorBroughton, J.pt_BR
dc.date.accessioned2009-10-13T16:03:46Zpt_BR
dc.date.accessioned2010-04-26T16:33:52Zpt_BR
dc.date.accessioned2014-10-20T15:58:14Zpt_BR
dc.date.accessioned2017-04-12T13:45:30Z-
dc.date.available2009-10-13T16:03:46Zpt_BR
dc.date.available2010-04-26T16:33:52Zpt_BR
dc.date.available2014-10-20T15:58:14Zpt_BR
dc.date.available2017-04-12T13:45:30Z-
dc.date.issued2009pt_BR
dc.identifier.urihttps://repositorio.lnec.pt/jspui/handle/123456789/16956-
dc.description.abstractIn order to contribute to the ongoing discussion on the reliability of epoxy (EP) and polyurethane (PUR) adhesives for load bearing structures, a study was conducted at LNEC where several structural adhesives were subjected to several temperature regimes and subsequently assessed, namely to compare their glass transition temperature (Tg) with tensile strength and stiffness decrease with increasing service temperature. Bonded joints including three different wood species and four selected adhesives were also tested in shear at a range of service temperatures in order to assess to what extent the thermal sensitivity of adhesives reflects in the behaviour of bonded joints. The results showed that the PUR and EP adhesives display significantly different viscoelastic responses over the temperature ranges attained normally in service during summer (20 to 60ºC). The study of the specific components and formulations of the various adhesives studied, showed a clear relationship with their strength and temperature stability. Temperature-induced creep is a risk factor that needs to be considered cautiously when approving novel adhesive types for structural applications. Because of that, careful adhesive selection, considering its glass transition temperature, thermal performance and possibly a post-cure procedure, should be made. Early assessment of bonded joints suggest that temperature may have a complex interaction with the materials and interfaces involved in the joint, where adhesive strength and stiffness play a role. Nevertheless, with the results obtained, when comparing DMA to Tensile Tests, the former seems to be a more expedite and revealing technique to help predicting the adhesives thermal behaviour when in a bonded joint.pt_BR
dc.format.extent10730 bytespt_BR
dc.format.mimetypeapplication/pdfpt_BR
dc.language.isoengpt_BR
dc.publisherUniversidad del Bío-Bíopt_BR
dc.rightsopenAccesspt_BR
dc.titleThermal stability of epoxy and polyurethane adhesives and bonded joints used in the rehabilitation of timber structurespt_BR
dc.typeconferenceObjectpt_BR
dc.identifier.seminarioIII Jornadas Chilenas de Estructuras de Madera y I Congreso Latino Americano de Estructuras de Maderapt_BR
dc.identifier.localConcepción, Chilept_BR
Appears in Collections:DM/NMC - Comunicações a congressos e artigos de revista



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