Please use this identifier to cite or link to this item: http://repositorio.lnec.pt:8080/jspui/handle/123456789/1000130
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dc.contributor.authorCustódio, J.pt_BR
dc.contributor.authorRodrigues, D.pt_BR
dc.contributor.authorCruz, H.pt_BR
dc.contributor.authorBroughton, J.pt_BR
dc.date.accessioned2010-05-06T15:15:00Zpt_BR
dc.date.accessioned2014-10-20T15:58:19Zpt_BR
dc.date.accessioned2017-04-12T16:08:00Z-
dc.date.available2010-05-06T15:15:00Zpt_BR
dc.date.available2014-10-20T15:58:19Zpt_BR
dc.date.available2017-04-12T16:08:00Z-
dc.date.issued2008pt_BR
dc.identifier.isbn1615670882pt_BR
dc.identifier.urihttps://repositorio.lnec.pt/jspui/handle/123456789/1000130-
dc.description.abstractIn order to contribute to the ongoing discussion on the reliability of epoxy (EP) and polyurethane (PUR) adhesives for load bearing structures, a study was conducted at LNEC where several structural adhesives were subjected to several temperature regimes and subsequently assessed, namely to compare their glass transition temperature (Tg) with strength and stiffness decrease with increasing service temperature. The results showed that the PUR and EP adhesives display significantly different viscoelastic responses over the temperature ranges attained normally in service. Thus temperature-induced creep is a risk factor that needs to be considered cautiously when approving novel adhesive types for structural applications. The study of the specific components and formulations of the various adhesives studied, showed that the resultant strength and temperature stability varied greatly. Because of that, careful adhesive selection, considering its glass transition temperature, thermal performance and possibly a post-cure procedure, should be made.pt_BR
dc.language.isoengpt_BR
dc.publisherEngineered Wood Products Association (Ewpa)pt_BR
dc.rightsopenAccesspt_BR
dc.titleCan Tg be used as a service temperature indicator for the selection of a structural adhesive?pt_BR
dc.typeconferenceObjectpt_BR
dc.identifier.seminario10th World Conference on Timber Engineering – WCTE 2008pt_BR
dc.identifier.localMiyazaki, Japãopt_BR
dc.description.sectorDM/NBpt_BR
dc.description.year2008pt_BR
dc.description.data2 a 5 de Junhopt_BR
Appears in Collections:DM/NMC - Comunicações a congressos e artigos de revista



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